CEM830

The CEM830 is a high performance COM Express module. It is designed to be future proof and to provide a smooth transition path from parallel PCI bus to serial PCI Express buses. This COM Express module supports Socket M type processors with 533/667MHz FSB including Intel® Core™2 Duo, Core™ Duo, Core™ Solo and Intel® Celeron® M processors. The CEM830 also features PCI Express x16 graphics port and PCI Express x1 I/O ports, next generation Serial ATA, and 8 hi-speed USB 2.0 connectivity. Besides, Fast Ethernet port is connected from PCI-E x1 bus (optional Gigabit Ethernet port) for high speed 100 Base-T networking connectivity. In the meanwhile, to support battery monitoring function and advanced monitoring/control, the CEM830 is with onboard SMBus for this interfacing feature. This COM Express type-II module offers fast time-to-market with reduced development cost and significant freedom in meeting form-fit-function requirements.

• Socket M Intel® Core™2 Duo processor with FSB 533/667 MHz
• Intel® 945GME + ICH7M chipset
• With high performance integrated graphics controller and discrete solution through PCIe x16 interface
• 20 lanes of PCI Express
• 8 USB 2.0 ports

• CEM830VE (PN-E38D830100) COM Express type-II module with socket M, VGA/LVDS LCD, 10/100Mbps
• CEM830VG (PN- E38D830102) COM Express type-II module with socket M, VGA/LVDS LCD, 10/100/1000Mbps
• CEM830VE-1G (PN-E38D830101) COM Express type-II module with Intel® Celeron® M (ULV 423) 1.06 GHz/1MB L2 Cache CPU onboard, VGA/LVDS LCD, 2 10/100Mbps
• CEB94000 ATX form factor baseboard
• 507CEM83020E CEM830/820 heatspreader module for PGA type CPU
• 507CEM83030E CEM830/820 heatspreader module for BGA type CPU
• 507CEM83040E COM Express cooling kit with fan
• 5078D830100E COM Express low profile cooling kit with fan
• 5078D830200E COM Express cooling kit without fan